PROCEEDINGS VOLUME 1339
34TH ANNUAL INTERNATIONAL TECHNICAL SYMPOSIUM ON OPTICAL AND OPTOELECTRONIC APPLIED SCIENCE AND ENGINEERING | 8-13 JULY 1990
Materials, Devices, Techniques, and Applications for Z-Plane Focal Plane Array Technology II
Editor(s): John C. Carson
34TH ANNUAL INTERNATIONAL TECHNICAL SYMPOSIUM ON OPTICAL AND OPTOELECTRONIC APPLIED SCIENCE AND ENGINEERING
8-13 July 1990
San Diego, CA, United States
Civil and Military Applications of Z-Plane Technology
Proc. SPIE 1339, Sensor exploitation of on-focal-plane signal processing for tactical airborne applications, 0000 (1 November 1990); doi: 10.1117/12.23003
Proc. SPIE 1339, Application of Z-plane technology to the remote sensing of the earth from geosynchronous orbit, 0000 (1 November 1990); doi: 10.1117/12.23004
Proc. SPIE 1339, Applications of smart neuromorphic focal planes, 0000 (1 November 1990); doi: 10.1117/12.23006
Proc. SPIE 1339, Image-processing applications of Z-plane technology, 0000 (1 November 1990); doi: 10.1117/12.23007
Proc. SPIE 1339, Neural network Z-plane implementation with very high interconnection rates, 0000 (1 November 1990); doi: 10.1117/12.23008
Proc. SPIE 1339, Using a small IR surveillance satellite for tactical applications, 0000 (1 November 1990); doi: 10.1117/12.23009
Proc. SPIE 1339, Establishing requirements for homing applications, 0000 (1 November 1990); doi: 10.1117/12.23010
Electronic Design and Technology for On-Focal-Plane Signal Processing
Proc. SPIE 1339, Potential architectures for superconductive IR focal plane sensors, 0000 (1 November 1990); doi: 10.1117/12.23011
Proc. SPIE 1339, On-array spike suppression signal processing, 0000 (1 November 1990); doi: 10.1117/12.23012
Proc. SPIE 1339, Low-power analog-to-digital converter, 0000 (1 November 1990); doi: 10.1117/12.23013
Proc. SPIE 1339, Development of algorithms for on-focal-plane gamma circumvention and time-delay integration, 0000 (1 November 1990); doi: 10.1117/12.23014
Proc. SPIE 1339, Current HYMOSS Z-technology overview, 0000 (1 November 1990); doi: 10.1117/12.23017
Z-Plane Module Manufacturing and Producibility
Proc. SPIE 1339, Packaging of electronics for on- and off-FPA signal processing, 0000 (1 November 1990); doi: 10.1117/12.23018
Proc. SPIE 1339, Producibility of Z-technology focal planes in a rate production/highly automated CIM environment, 0000 (1 November 1990); doi: 10.1117/12.23019
Proc. SPIE 1339, Automation challenges for space on earth: the challenges of pioneering hybrid circuit automation, 0000 (1 November 1990); doi: 10.1117/12.23020
Proc. SPIE 1339, Space/performance qualification of the tape automated bonded devices, 0000 (1 November 1990); doi: 10.1117/12.23021
Proc. SPIE 1339, Putting the automation in tape automated bonding, 0000 (1 November 1990); doi: 10.1117/12.23022
Proc. SPIE 1339, High-speed/high-volume radiometric testing of Z-technology focal planes, 0000 (1 November 1990); doi: 10.1117/12.23023
Proc. SPIE 1339, Production integration of automated SPC/SQC testing and inspection for rate production of Z-architecture focal planes, 0000 (1 November 1990); doi: 10.1117/12.23024
Proc. SPIE 1339, 128-layer HYMOSS-module fabrication issues, 0000 (1 November 1990); doi: 10.1117/12.23025
Detector Fabrication and Integration
Proc. SPIE 1339, Automation of IRFPA production processes, 0000 (1 November 1990); doi: 10.1117/12.23026
Electronic Design and Technology for On-Focal-Plane Signal Processing
Proc. SPIE 1339, Z-plane technology: retrospective and predictions, 0000 (1 November 1990); doi: 10.1117/12.23030
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