1 November 1990 Automation of IRFPA production processes
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Abstract
This paper examines three applications of automation technology in the manufacture of Infrared Focal Plane arrays. Areas to be examined ar wafer handling during array fabrication up through dicing, automation ofLiquid Phase Epitaxy, and automation of bump bonding. The collection of factory data and its use in control of the manufacturing process will also be discussed. Specifics related to the production of Z-module architecture will be emphasized.
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James Egerton, James Egerton, Nancy Dieselman, Nancy Dieselman, William M. Higgins, William M. Higgins, Peter H. Zimmermann, Peter H. Zimmermann, Ashok Sood, Ashok Sood, } "Automation of IRFPA production processes", Proc. SPIE 1339, Materials, Devices, Techniques, and Applications for Z-Plane Focal Plane Array Technology II, (1 November 1990); doi: 10.1117/12.23026; https://doi.org/10.1117/12.23026
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