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1 November 1990 Space/performance qualification of the tape automated bonded devices
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Abstract
Quality assurance, wafer lot production, device testing, postprobe processing, and qualification and quality screening of tape automated bonded devices are discussed. These devices are qualifed for space applications and ready to assemble directly into production modules.
© (1990) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Omkarnath K. Gupta and James J. Knight "Space/performance qualification of the tape automated bonded devices", Proc. SPIE 1339, Materials, Devices, Techniques, and Applications for Z-Plane Focal Plane Array Technology II, (1 November 1990); https://doi.org/10.1117/12.23021
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