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1 January 1991 Applications of Z-Plane memory technology to high-frame rate imaging systems
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Abstract
Z-Plane memory packaging technology utilizes the process of stacking integrated circuits (ICs) to each other in order to increase packaging density. This paper will discuss how Z-plane technology can be applied to memory systems used in high frame-rate imaging systems. 1.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Stuart N. Shanken and David E. Ludwig "Applications of Z-Plane memory technology to high-frame rate imaging systems", Proc. SPIE 1346, Ultrahigh- and High-Speed Photography, Videography, Photonics, and Velocimetry '90, (1 January 1991); https://doi.org/10.1117/12.23350
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