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1 January 1991 High-density memory packaging technology high-speed imaging applications
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Abstract
Advancements in image acquisition and processing technology are exceeding the capability of traditional magnetic tape recording. For scientific industrial and military applications a solid state high-density recording medium is required to store data generated at a rate of tens of Gigabits per second from moderate resolution high frame rate imagers. This paper discusses a three-dimensional (3-D) approach to memory packaging developed jointly by DARPA and Texas Instruments (TI). This packaging approach makes it feasible to economically produce a small rugged recorder for high speed solid state imaging applications. 1.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dean L. Frew "High-density memory packaging technology high-speed imaging applications", Proc. SPIE 1346, Ultrahigh- and High-Speed Photography, Videography, Photonics, and Velocimetry '90, (1 January 1991); https://doi.org/10.1117/12.23349
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