1 January 1991 Fast, epoxiless bonding system for fiber optic connectors
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Proceedings Volume 1365, Components for Fiber Optic Applications V; (1991) https://doi.org/10.1117/12.24675
Event: SPIE Microelectronic Interconnect and Integrated Processing Symposium, 1990, San Jose, United States
Abstract
The epoxy adhesives traditionally used to bond optical fibers into connectors complicate the connector assembly process due to their limitations in shelf life pot life ease of application and cure time. 3M has developed a new high performance hotmelt adhesive fiber bonding system which overcomes the limitations of the epoxies while providing additional benefits in ease of use and reduced installed cost.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Nicholas A. Lee, "Fast, epoxiless bonding system for fiber optic connectors", Proc. SPIE 1365, Components for Fiber Optic Applications V, (1 January 1991); doi: 10.1117/12.24675; https://doi.org/10.1117/12.24675
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