1 February 1991 Top-side electroluminescence: a failure analysis technique to view electroluminescence along a laser channel
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Proceedings Volume 1366, Fiber Optics Reliability: Benign and Adverse Environments IV; (1991) https://doi.org/10.1117/12.24688
Event: SPIE Microelectronic Interconnect and Integrated Processing Symposium, 1990, San Jose, United States
Abstract
Electroluminescence imaging along the optical channel of a laser diode can show non-radiative defects or non-uniform emission in the channel which may be contributing to failure. This imaging technique is easily done on specially prepared test sites or on lasers that have not been diced and packaged. Once the laser diode is packaged (typically in a TO type package) it is difficult to utilize this technique due to the difficulty in successfully exposing the optical channel for inspection. This paper describes a practical technique to perform optical channel electroluminescence imaging of packaged laser diodes. It has been successfully applied to 780nm, 800nm, and 1300nm laser diodes. The information obtained can be used to improve reliability and/or life of the product analyzed. This paper will highlight details of the technique along with illustrations of typical results. Applications to failure analysis will also be discussed.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Victor O. Blow, Victor O. Blow, Kenneth J. Giewont, Kenneth J. Giewont, } "Top-side electroluminescence: a failure analysis technique to view electroluminescence along a laser channel", Proc. SPIE 1366, Fiber Optics Reliability: Benign and Adverse Environments IV, (1 February 1991); doi: 10.1117/12.24688; https://doi.org/10.1117/12.24688
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