1 March 1991 Large-scale industrial application for excimer lasers: via-hole-drilling by photoablation
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Proceedings Volume 1377, Excimer Laser Materials Processing and Beam Delivery Systems; (1991) https://doi.org/10.1117/12.25035
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States
Abstract
Numerous potential excimer laser processing applications have recently been reported in the literature but examples of large scale excimer laser use in an industrial environment are very rare. In this article we inform about the different techniques and also about one of the first processes in which excimer lasers are used in a production line: Via-holes with aspect ratios close to one used in a printed circuit board of a high density multi-chip module are generated by ablation of the dielectric layer in an extremely reliable and reproducible way. The important processing parameters will be discussed.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Friedrich G. Bachmann, "Large-scale industrial application for excimer lasers: via-hole-drilling by photoablation", Proc. SPIE 1377, Excimer Laser Materials Processing and Beam Delivery Systems, (1 March 1991); doi: 10.1117/12.25035; https://doi.org/10.1117/12.25035
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