Large-scale industrial application for excimer lasers: via-hole-drilling by photoablation

Friedrich G. Bachmann

doi:10.1117/12.25035

1 March 1991 Large-scale industrial application for excimer lasers: via-hole-drilling by photoablation

Friedrich G. Bachmann

Proceedings Volume 1377, Excimer Laser Materials Processing and Beam Delivery Systems; (1991) https://doi.org/10.1117/12.25035
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States

Abstract

Numerous potential excimer laser processing applications have recently been reported in the literature but examples of large scale excimer laser use in an industrial environment are very rare. In this article we inform about the different techniques and also about one of the first processes in which excimer lasers are used in a production line: Via-holes with aspect ratios close to one used in a printed circuit board of a high density multi-chip module are generated by ablation of the dielectric layer in an extremely reliable and reproducible way. The important processing parameters will be discussed.

Citation Download Citation

Friedrich G. Bachmann "Large-scale industrial application for excimer lasers: via-hole-drilling by photoablation", Proc. SPIE 1377, Excimer Laser Materials Processing and Beam Delivery Systems, (1 March 1991); https://doi.org/10.1117/12.25035

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available