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1 February 1991 Automated visual inspection system for IC bonding wires using morphological processing
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Proceedings Volume 1384, High-Speed Inspection Architectures, Barcoding, and Character Recognition; (1991) https://doi.org/10.1117/12.25306
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States
Abstract
This paper discusses an automated visual inspection system for IC bonding wires that uses high-contrast image capture and an accurate bonding-ball measurement algorithm. On IC assembly lines visual inspection is vital to maintaining IC reliability. Wire bonding requires the automated evaluation of bonding quality to maintain productivity. Both bonding balls and wires must be inspected to evaluate bonding quality. We developed a bonding-ball measurement algorithm based on subpixel and morphological techniques and a wire inspection algorithm based on border following. The automated inspection system measures ball diameters to an accuracy within jim which corresponds to one-half pixel taking 0. 2 seconds to inspect a wire and ball. Paired with a wire bonder the inspection system configures a fully automatic bonding system.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hiroyuki Tsukahara, Masato Nakashima, and Takehisa Sugawara "Automated visual inspection system for IC bonding wires using morphological processing", Proc. SPIE 1384, High-Speed Inspection Architectures, Barcoding, and Character Recognition, (1 February 1991); https://doi.org/10.1117/12.25306
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