Analysis of skin effect loss in high-frequency interconnects with finite metallization thickness

Jean-Fu Kiang

doi:10.1117/12.25536

1 April 1991 Analysis of skin effect loss in high-frequency interconnects with finite metallization thickness

Jean-Fu Kiang

Proceedings Volume 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies; (1991) https://doi.org/10.1117/12.25536
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States

Abstract

The skin effect of single and coupled conductor strips of finite thickness is analyzed using the dyadic Green''s function and integral equation formulation. Galerkin''s method is used to solve the integral equation for the dispersion characteristics. The effects of the geometrical and the electrical parameters on the conductor loss are investigated. Results are compared with literature and shown to be in good agreement. This approach is very useful for analyzing the electrical properties of interconnects in high performance computer circuitries.

Citation Download Citation

Jean-Fu Kiang "Analysis of skin effect loss in high-frequency interconnects with finite metallization thickness", Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); https://doi.org/10.1117/12.25536

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