1 April 1991 Design and process impact on thin-film interconnection performance
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Abstract
The performance of thin-film interconnections is influenced by the manner in which material selection and design rules interact with process capabilities. To understand this influence analysis of predicted and measured interconnection performance was correlated to design and process attributes. The models employed to predict propagation delay and noise are described and compared to experimental results. Attributes which contribute significantly to successful implementation of this technology are identified and accommodations in process controls and design rules are suggested.
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Glenn A. Rinne, Glenn A. Rinne, Lih-Tyng Hwang, Lih-Tyng Hwang, Gretchen M. Adema, Gretchen M. Adema, Donald A. King, Donald A. King, Iwona Turlik, Iwona Turlik, } "Design and process impact on thin-film interconnection performance", Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); doi: 10.1117/12.25514; https://doi.org/10.1117/12.25514
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