1 April 1991 Integrated packaging of optical backplanes
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Abstract
An approach is described to integrate optical systems on single substrates. It uses free-space optical propagation of the light signals inside the substrate and lithographically fabricated optical elements that can be aligned and mounted with submicron precision. Two-dimensional arrays of surface-emitting laser diodes and detector arrays can be used to implement integrated-optical backplanes in electronic multiprocessor systems or all-optical computers.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Juergen Jahns, "Integrated packaging of optical backplanes", Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); doi: 10.1117/12.25551; https://doi.org/10.1117/12.25551
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