1 April 1991 Novel microstructures for low-distortion chip-to-chip interconnects
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Abstract
To shift the onset of skin resistance in off-chip interconnects novel microstructures are proposed as a method to maximize conductor surface area for a given pitch. We consider lines of Scm length operating at 1GHz with ~6dB attenuation. Assuming thin but wide lines (aspect ratio 10:1) for low distortion then conventional microstrip lines would require a 5Oim pitch theoretical study shows that a vertical coplanar line essentially a tall double-strip coplanar line could be packed twice as densely. Circuit theory and field theory which accounts for fringing are used to predict a reduction in high frequency resistance in laminated microstrip lines as well. Reduction in resistance was observed in a large-scale model of a transposed multiple-conductor microstrip line. Microfabrication of phase-velocity matched laminated lines demonstrated the difficulty of matching material constants emphasizing the relative strength of transposed laminated lines which do not require matching.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Heinrich C. Blennemann, Heinrich C. Blennemann, Roger Fabian W. Pease, Roger Fabian W. Pease, } "Novel microstructures for low-distortion chip-to-chip interconnects", Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); doi: 10.1117/12.25525; https://doi.org/10.1117/12.25525
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