1 April 1991 Proposed electro-optic package with bidirectional lensed coupling
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Abstract
Optical packages with multiple optical I/Os and without optical pigtails or conventional connectors are proposed. These conceptual packages are of a hybrid PGA style with LSI chips and arrays of optical sources and detectors. A central theme is the use of only moderate extensions of current single chip and PWB packaging technologies. The light coupling between devices and waveguides is to be achieved using an array of lenses and/or microprisms. The feasibility of such a package is discussed from engineering manufacturing and repairability viewpoints.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
K. Rajasekharan, K. Rajasekharan, Timothy Michalka, Timothy Michalka, } "Proposed electro-optic package with bidirectional lensed coupling", Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); doi: 10.1117/12.25557; https://doi.org/10.1117/12.25557
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