1 April 1991 V-line: a new interconnect for packaging and microwave applications
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Abstract
A new transmission line configuration is presented for microwave and high-speed digital applications. The structure consists of a conducting strip over a triangular ground reference and offer superior electromagnetic performance at higher frequencies with lower radiation and lower coupling between neighboring interconnect lines. Parameters resulting from a static analysis are shown as a function of the geometrical characteristics and a full wave analysis is used to establish the frequency dependence of the propagation constant. Experimental results are compared with the theoretical data to validate the analysis and determine the advantages of the new structure.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jose E. Schutt-Aine, Jose E. Schutt-Aine, Jin-Fa Lee, Jin-Fa Lee, } "V-line: a new interconnect for packaging and microwave applications", Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); doi: 10.1117/12.25516; https://doi.org/10.1117/12.25516
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