1 April 1991 Advanced multichip module packaging and interconnect issues for GaAs signal processors operating above 1 GHz clock rates
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Proceedings Volume 1390, Microelectronic Interconnects and Packages: System and Process Integration; (1991) https://doi.org/10.1117/12.25580
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States
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© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Barry K. Gilbert, Barry K. Gilbert, R. Thompson, R. Thompson, Gregg Fokken, Gregg Fokken, W. McNeff, W. McNeff, Jeffrey A. Prentice, Jeffrey A. Prentice, David O. Rowlands, David O. Rowlands, A. Staniszewski, A. Staniszewski, Wes Walters, Wes Walters, S. Zahn, S. Zahn, George W. Pan, George W. Pan, } "Advanced multichip module packaging and interconnect issues for GaAs signal processors operating above 1 GHz clock rates", Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25580; https://doi.org/10.1117/12.25580
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