1 April 1991 Flow behavior of thermoset molding compound in conventional PDIP molds
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Proceedings Volume 1390, Microelectronic Interconnects and Packages: System and Process Integration; (1991) https://doi.org/10.1117/12.25611
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States
Abstract
A study was conducted to understand the effects of niold conipound flow behavior on disturbed wire occurences in plastic packages. Fluid niechanics considerations were used to determine the type of flow effects of the boundary layer shear stresses and velocity profile to the bond wire. Short shots and the use of colored pellets helped in the visualization of flow patterns. A plastic deforniation of beanis niodel was used to estimate the amount of force required to sway a wire and conipared to the force calculated from plastic flow velocity distribution.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Marcelo S. Gonzalez, Marcelo S. Gonzalez, Manolo G. Mena, Manolo G. Mena, "Flow behavior of thermoset molding compound in conventional PDIP molds", Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25611; https://doi.org/10.1117/12.25611
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