1 April 1991 Modeling progress and trends in electrical interconnects
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Proceedings Volume 1390, Microelectronic Interconnects and Packages: System and Process Integration; (1991); doi: 10.1117/12.25583
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States
Abstract
Technology capability in packaging interconnects has outrun the design capability. Here ''design" is used in the sense which includes setting and meeting performance metrics as well as performing geometric layout. Limitations on design capability are due in part to lack of detailed understanding of mechanisms or lack of " expertness" available to incorporate into a design system. Progress in design capability will be discussed capability gaps noted impact of drivers examined and practical examples given.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John L. Prince, Andreas C. Cangellaris, Olgierd A. Palusinski, "Modeling progress and trends in electrical interconnects", Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25583; https://doi.org/10.1117/12.25583
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