1 April 1991 Packaging issues for free-space optically interconnected multiprocessors
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Proceedings Volume 1390, Microelectronic Interconnects and Packages: System and Process Integration; (1991) https://doi.org/10.1117/12.25602
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States
Abstract
The technical feasibility and the performance of packaged systems with free space optical interconnections for parallel computing are analyzed. System issues such as volume power consumption optical properties of interconnection elements yield problems and noise limitations are considered and their dependence on the existing and future technological constraints are outlined.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Volkan H. Ozguz, Sadik C. Esener, Sing H. Lee, "Packaging issues for free-space optically interconnected multiprocessors", Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25602; https://doi.org/10.1117/12.25602
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