1 April 1991 Packaging technology for the NEC SX-3 supercomputers
Author Affiliations +
Proceedings Volume 1390, Microelectronic Interconnects and Packages: System and Process Integration; (1991) https://doi.org/10.1117/12.25572
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States
There is no online version at this time. The PDF is only available to people who have bought the paper or have a subscription.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hiroshi Murano, Hiroshi Murano, Toshihiko Watari, Toshihiko Watari, } "Packaging technology for the NEC SX-3 supercomputers", Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25572; https://doi.org/10.1117/12.25572
PROCEEDINGS
13 PAGES


SHARE
KEYWORDS
RELATED CONTENT

Laser via-hole drilling of printed wiring board
Proceedings of SPIE (November 06 2000)
Configurations of LED arrays for uniform illumination
Proceedings of SPIE (October 21 2004)
Latest development for space applications at Sofradir
Proceedings of SPIE (November 01 2007)
Optical fiber packaging for MEMS interfacing
Proceedings of SPIE (February 23 2009)
Adhesive curing options for photonic packaging
Proceedings of SPIE (June 25 2002)

Back to Top