1 April 1991 Packaging technology for the NEC SX-3 supercomputers
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Proceedings Volume 1390, Microelectronic Interconnects and Packages: System and Process Integration; (1991) https://doi.org/10.1117/12.25572
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States
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© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hiroshi Murano, Hiroshi Murano, Toshihiko Watari, Toshihiko Watari, } "Packaging technology for the NEC SX-3 supercomputers", Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25572; https://doi.org/10.1117/12.25572
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