1 April 1991 Photonic Multichip Packaging (PMP) using electro-optic organic materials and devices
Author Affiliations +
Proceedings Volume 1390, Microelectronic Interconnects and Packages: System and Process Integration; (1991) https://doi.org/10.1117/12.25584
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States
Abstract
The limitations ofmetal interconnections in MultiChip Modules (MCM''s) are examined primarily with respect to their bandwidth arid propagation loss. Comparison is made with the alternative ofemploying optical interconnections. Some of the technical issues which lie ahead to make a Photonic Multichip Package (PMP) possible are explored. Certain organic materials are identified as promising candidates for implementing optical interconnections. These are found to be interesting because of their low deposition temperatures and because they lend themselves to fabrication by techniques that are already finding acceptance for metal interconnections in thin film MCM manufacturing.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John F. McDonald, Nickolas P. Vlannes, Toh-Ming Lu, Gary E. Wnek, Theodore C. Nason, Lu You, "Photonic Multichip Packaging (PMP) using electro-optic organic materials and devices", Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25584; https://doi.org/10.1117/12.25584
PROCEEDINGS
16 PAGES


SHARE
Back to Top