1 April 1991 State-of-the-art multichip modules for avionics
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Proceedings Volume 1390, Microelectronic Interconnects and Packages: System and Process Integration; (1991) https://doi.org/10.1117/12.25575
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States
The emerging multichip packaging technology offers significant advantages in miniaturization faster electrical performance efficient thermal performance lower cost and significantly improved reliability. Newly available materials and processes have stimulated multichip applications ranging from low-cost consumer electronics and automotive modules to advanced aerospace and supercomputer applications. Avionics multichip modules share the same systems integration issues as other applications: optimum partitioning seamless CAD/CIM tools testability and repairability strategies cost-effective manufacturing availability of vendor support technologies and reliable packaging for long life in environmental stresses. This paper discusses state-of-the-art avionics multichip modules industry developments required to enable wider utilization and evolutionary extensions into next generation technologies.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John K. Hagge, John K. Hagge, } "State-of-the-art multichip modules for avionics", Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25575; https://doi.org/10.1117/12.25575

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