1 April 1991 System interconnection of high-density multichip modules
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Proceedings Volume 1390, Microelectronic Interconnects and Packages: System and Process Integration; (1991) https://doi.org/10.1117/12.25582
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States
Abstract
Multi-chip modules (MOM) have recently received much attention because they facilitate high density and speed packaging of electronic systems. MOM''s tradeoffs are examined here for logic and memory subsystems using a newly developed package system simulation methodology. MOM''s are optimized for CMOS technologies using the simulated annealing algorithm. Parameters for optimum MOM designs are shown to separate clearly in the response space. Based on this guidelines for computer system integration with MOM''s are set up.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
J. Peter Krusius, J. Peter Krusius, } "System interconnection of high-density multichip modules", Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25582; https://doi.org/10.1117/12.25582
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