1 April 1991 Wafer scale integration modular packaging
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Proceedings Volume 1390, Microelectronic Interconnects and Packages: System and Process Integration; (1991) https://doi.org/10.1117/12.25574
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States
There is no online version at this time. The PDF is only available to people who have bought the paper or have a subscription.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Joe E. Brewer, Joe E. Brewer, Larry E. French, Larry E. French, } "Wafer scale integration modular packaging", Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25574; https://doi.org/10.1117/12.25574
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