1 March 1991 Defect reduction strategies for submicron manufacturing: tools and methodologies
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Proceedings Volume 1392, Advanced Techniques for Integrated Circuit Processing; (1991) https://doi.org/10.1117/12.48956
Event: Processing Integration, 1990, Santa Clara, CA, United States
Reducing and controlling defect densities is critical to the successful manufacture of semiconductor devices. Automated wafer inspection tools detecting smaller defects and providing more consistent results L2than previous techniques are being used more and more in this effort. In order to use these tools effectively a structured approach must be taken. In addition understanding the performance ofthe automated inspection tool is key to correctly interpreting the information it provides. This paper will describe a defect reduction methodology employing an automated wafer inspection tool which has been successfully applied by several semiconductor manufacturers. The critical aspects of applying such a program are discussed in a case study format. The second portion of this paper presents possible barriers to a succesful defect reduction program. The organizational elements of a successful program are discussed. A methodology for evaluating the performance of an automated wafer inspection tool is outlined. The design of a test vehicle useful for tool characterization is described. Parameters which have been shown to have significant impact on the performance of wafer inspection tools are identified. Data illustrating the methodology is presented.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Robyn Sue Coleman, Prasanna R. Chitturi, "Defect reduction strategies for submicron manufacturing: tools and methodologies", Proc. SPIE 1392, Advanced Techniques for Integrated Circuit Processing, (1 March 1991); doi: 10.1117/12.48956; https://doi.org/10.1117/12.48956

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