1 April 1991 RTP temperature uniformity mapping
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Proceedings Volume 1393, Rapid Thermal and Related Processing Techniques; (1991); doi: 10.1117/12.25718
Event: Processing Integration, 1990, Santa Clara, CA, United States
Abstract
This paper presents innovative software developed to help generate a temperature calibration curve and to mathematically manipulate and combine multi-point wafer maps. The software automatically applies the calibration curve to a map of film parameters to provide a quantitative map of temperature uniformity. Several process examples are presented to demonstrate the flexibility and convenience of the software. 1.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
W. Andrew Keenan, Walter H. Johnson, David T. Hodul, David Mordo, "RTP temperature uniformity mapping", Proc. SPIE 1393, Rapid Thermal and Related Processing Techniques, (1 April 1991); doi: 10.1117/12.25718; https://doi.org/10.1117/12.25718
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KEYWORDS
Semiconducting wafers

Oxides

Resistance

Calibration

Temperature metrology

Fourier transforms

Ions

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