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1 July 1991 I-line lithography for highly reproducible fabrication of surface acoustic wave devices
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Abstract
A patterning process with a linewidth resolution of 0.4 micrometers using i-line lithography and liftoff technique is presented for the fabrication of surface acoustic wave components. Using two resists systems, the process is developed and optimized with regards to exposure latitude and high resolution. Furthermore, a method is shown to determine linewidth variations in the lithography process by frequency measurements of surface acoustic wave resonators at a wafer prober. Reproducibility, versatility and resolution limit of the process is demonstrated by several realized devices.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Stefan Berek, Ulrich Knauer, and Helmut Zottl "I-line lithography for highly reproducible fabrication of surface acoustic wave devices", Proc. SPIE 1463, Optical/Laser Microlithography IV, (1 July 1991); https://doi.org/10.1117/12.44811
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