Photoresist dissolution rates: a comparison of puddle, spray, and immersion processes

Stewart A. Robertson; J. Tom M. Stevenson; Robert J. Holwill; Mark Thirsk; Ivan S. Daraktchiev; Steven G. Hansen

doi:10.1117/12.44438

1 July 1991 Photoresist dissolution rates: a comparison of puddle, spray, and immersion processes

Stewart A. Robertson, J. Tom M. Stevenson, Robert J. Holwill, Mark Thirsk, Ivan S. Daraktchiev, Steven G. Hansen

Proceedings Volume 1464, Integrated Circuit Metrology, Inspection, and Process Control V; (1991) https://doi.org/10.1117/12.44438
Event: Microlithography, 1991, San Jose, CA, United States

Abstract

Design and operation of an on-line Track Development Rate Monitor (TDRM) for track development systems are described. Dissolution data, measured using this equipment, for spray and puddle development processes is presented and compared to those derived from a conventional immersion DRM. Immersion data has traditionally been used to model all development. The validity of this is discussed. Also presented is an off-line technique for evaluating dissolution rates which utilize no specialized DRM equipment. The dissolution rates as measured by this technique are compared with those obtained from the TDRM/DRM methods. Simulations using all the calculated dissolution parameters are compared with SEM cross sections so that a practical evaluation of the various techniques can be made.

Citation Download Citation

Stewart A. Robertson, J. Tom M. Stevenson, Robert J. Holwill, Mark Thirsk, Ivan S. Daraktchiev, and Steven G. Hansen "Photoresist dissolution rates: a comparison of puddle, spray, and immersion processes", Proc. SPIE 1464, Integrated Circuit Metrology, Inspection, and Process Control V, (1 July 1991); https://doi.org/10.1117/12.44438

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