Semiwafer metrology project

Marylyn Hoy Bennett; William Mark Hiatt; Laurie J. Lauchlan; Lynda Clark Hannemann-Mantalas; Hans Rottmann; Mark A. Seliger; Bhanwar Singh; Don E. Yansen

doi:10.1117/12.44472

1 July 1991 Semiwafer metrology project

Marylyn Hoy Bennett, William Mark Hiatt, Laurie J. Lauchlan, Lynda Clark Hannemann-Mantalas, Hans Rottmann, Mark A. Seliger, Bhanwar Singh, Don E. Yansen

Author Affiliations +

Proceedings Volume 1464, Integrated Circuit Metrology, Inspection, and Process Control V; (1991) https://doi.org/10.1117/12.44472
Event: Microlithography, 1991, San Jose, CA, United States

Abstract

A wafer metrology 'round robin' has been completed comparing linewidth measurements from several different companies and different measurement tools and technologies. The project has been conducted under the auspices of SEMI by members of SEMI's Metrology Committee. The goals of the program were: (1) determine the range of critical dimension values measured across the United States, (2) test the newly formulated SEMI linewidth patterns, (3) assess the effect of calibration differences of the measured values.

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Marylyn Hoy Bennett, William Mark Hiatt, Laurie J. Lauchlan, Lynda Clark Hannemann-Mantalas, Hans Rottmann, Mark A. Seliger, Bhanwar Singh, and Don E. Yansen "Semiwafer metrology project", Proc. SPIE 1464, Integrated Circuit Metrology, Inspection, and Process Control V, (1 July 1991); https://doi.org/10.1117/12.44472

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