1 July 1991 Semiwafer metrology project
Author Affiliations +
A wafer metrology 'round robin' has been completed comparing linewidth measurements from several different companies and different measurement tools and technologies. The project has been conducted under the auspices of SEMI by members of SEMI's Metrology Committee. The goals of the program were: (1) determine the range of critical dimension values measured across the United States, (2) test the newly formulated SEMI linewidth patterns, (3) assess the effect of calibration differences of the measured values.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Marylyn Hoy Bennett, Marylyn Hoy Bennett, William Mark Hiatt, William Mark Hiatt, Laurie J. Lauchlan, Laurie J. Lauchlan, Lynda Clark Hannemann-Mantalas, Lynda Clark Hannemann-Mantalas, Hans Rottmann, Hans Rottmann, Mark A. Seliger, Mark A. Seliger, Bhanwar Singh, Bhanwar Singh, Don E. Yansen, Don E. Yansen, } "Semiwafer metrology project", Proc. SPIE 1464, Integrated Circuit Metrology, Inspection, and Process Control V, (1 July 1991); doi: 10.1117/12.44472; https://doi.org/10.1117/12.44472


Impact of reticle defects on submicron 5x lithography
Proceedings of SPIE (May 31 1990)
Accuracy of Spatial Metrology
Proceedings of SPIE (July 18 1989)
Metrology issues associated with submicron linewidths
Proceedings of SPIE (June 30 1991)
Half-micrometer linewidth metrology
Proceedings of SPIE (June 30 1991)

Back to Top