1 July 1991 Using the Atomic Force Microscope to measure submicron dimensions of integrated circuit devices and processes
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Proceedings Volume 1464, Integrated Circuit Metrology, Inspection, and Process Control V; (1991); doi: 10.1117/12.44448
Event: Microlithography, 1991, San Jose, CA, United States
Abstract
Decreasing dimensions in the processing and manufacture of integrated circuits (ICs) has stimulated interest in ultra-high resolution measuring technologies. The Atomic Force Microscope (AFM), which is now available commercially, offers three-dimensional surface measurement capability from angstroms to over 100 microns, the ability to image insulators directly without coating, and minimal sample preparation. These features indicate strong potential for applications in IC related inspection, process engineering, failure analysis and reliability, particularly as ICs move toward submicron geometries.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mark R. Rodgers, Kevin M. Monahan, "Using the Atomic Force Microscope to measure submicron dimensions of integrated circuit devices and processes", Proc. SPIE 1464, Integrated Circuit Metrology, Inspection, and Process Control V, (1 July 1991); doi: 10.1117/12.44448; https://doi.org/10.1117/12.44448
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KEYWORDS
Atomic force microscopy

Integrated circuits

Photomasks

Inspection

Scanners

Image processing

Photoresist materials

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