1 August 1991 Process latitudes in projection printing
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Abstract
A simulation package has been developed to address a wide variety of process latitude issues. The authors demonstrate its versatility by studying three examples: (i) process latitude degradation due to notching, (ii) line width dependence of a newly developed negative I-line chemically amplified resist on baking time, and (iii) linewidth control of an exposed x-ray 0.5 (mu) line as a function of baking time. A powerful all-purpose 3-D dissolution algorithm has been developed for this purpose. It is the only dissolution algorithm capable of handling changes to topology of the dissolution surface.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Eytan Barouch, Uwe Hollerbach, Steven A. Orszag, Brian D. Bradie, Martin C. Peckerar, "Process latitudes in projection printing", Proc. SPIE 1465, Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing, (1 August 1991); doi: 10.1117/12.47360; https://doi.org/10.1117/12.47360
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