Paper
1 June 1991 Critical dimension shift resulting from handling time variation in the track coat process
John M. Kulp
Author Affiliations +
Abstract
A study was undertaken to determine if the critical dimension (CD) of a photoresist window varied due to variations in handling time between soft bake and the subsequent forced cool on a cool plate. A statistically significant shift in the CD was observed; the shift was correlated with the handling time variation with a confidence level of 90%. The trend of the observed shift at 42% relative humidity described a 0.0012 micrometers reduction in window dimension per second of added delay between soft bake and forced cool. Recommendations for optimum handling time control are identified for the conditions employed in this study; indications of optimum humidity for bake latitude are discussed.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John M. Kulp "Critical dimension shift resulting from handling time variation in the track coat process", Proc. SPIE 1466, Advances in Resist Technology and Processing VIII, (1 June 1991); https://doi.org/10.1117/12.46411
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Humidity

Semiconducting wafers

Critical dimension metrology

Photoresist materials

Cadmium

Wafer testing

Thin film coatings

Back to Top