1 June 1991 Dry development and plasma durability of resists: melt viscosity and self-diffusion effects
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Abstract
The degradation mechanisms of novolaks and high molecular weight polymers during plasma etching are investigated. The mechanical effects of ion bombardment are shown to generate surface degradation whereas the thermal effects allow the extension of the degradation to the bulk through self diffusion of chains. The various experiments clearly demonstrate the role of chain mobility and viscoelastic properties in the bulk degradation of polymers. If self diffusion, and this degradation, can easily occur with low molecular weight polymers, chain scission in high molecular weight polymers can lead to the same result. Degradation can be avoided by crosslinking polymer chains before or during plasma etching. Experiments with several commercial resist are given as an example.
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Patrick Jean Paniez, Patrick Jean Paniez, Olivier P. Joubert, Olivier P. Joubert, Michel J. Pons, Michel J. Pons, Jean Claude Oberlin, Jean Claude Oberlin, Andre P. Weill, Andre P. Weill, } "Dry development and plasma durability of resists: melt viscosity and self-diffusion effects", Proc. SPIE 1466, Advances in Resist Technology and Processing VIII, (1 June 1991); doi: 10.1117/12.46406; https://doi.org/10.1117/12.46406
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