Mixed application MMIC technologies: progress in combining RF, digital, and photonic circuits

Stan E. Swirhun; Mark P. Bendett; Vladimir Sokolov; Paul E. Bauhahn; Charles T. Sullivan; R. Mactaggart; Sayan D. Mukherjee; Mary K. Hibbs-Brenner; J. P. Mondal

doi:10.1117/12.44499

1 July 1991 Mixed application MMIC technologies: progress in combining RF, digital, and photonic circuits

Stan E. Swirhun, Mark P. Bendett, Vladimir Sokolov, Paul E. Bauhahn, Charles T. Sullivan, R. Mactaggart, Sayan D. Mukherjee, Mary K. Hibbs-Brenner, J. P. Mondal

Author Affiliations +

Proceedings Volume 1475, Monolithic Microwave Integrated Circuits for Sensors, Radar, and Communications Systems; (1991) https://doi.org/10.1117/12.44499
Event: Orlando '91, 1991, Orlando, FL, United States

Abstract

Approaches for future 'mixed application' monolithic integrated circuits (ICs) employing optical receive/transmit, RF amplification and modulation and digital control functions are discussed. We focus on compatibility of the photonic component fabrication with conventional RF and digital IC technologies. Recent progress at Honeywell in integrating several parts of the desired RF/digital/photonic circuit integration suite required for construction of a future millimeter-wave optically-controlled phased-array element are illustrated.

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Stan E. Swirhun, Mark P. Bendett, Vladimir Sokolov, Paul E. Bauhahn, Charles T. Sullivan, R. Mactaggart, Sayan D. Mukherjee, Mary K. Hibbs-Brenner, and J. P. Mondal "Mixed application MMIC technologies: progress in combining RF, digital, and photonic circuits", Proc. SPIE 1475, Monolithic Microwave Integrated Circuits for Sensors, Radar, and Communications Systems, (1 July 1991); https://doi.org/10.1117/12.44499

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