1 July 1991 Mixed application MMIC technologies: progress in combining RF, digital, and photonic circuits
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Approaches for future 'mixed application' monolithic integrated circuits (ICs) employing optical receive/transmit, RF amplification and modulation and digital control functions are discussed. We focus on compatibility of the photonic component fabrication with conventional RF and digital IC technologies. Recent progress at Honeywell in integrating several parts of the desired RF/digital/photonic circuit integration suite required for construction of a future millimeter-wave optically-controlled phased-array element are illustrated.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Stan E. Swirhun, Stan E. Swirhun, Mark P. Bendett, Mark P. Bendett, Vladimir Sokolov, Vladimir Sokolov, Paul E. Bauhahn, Paul E. Bauhahn, Charles T. Sullivan, Charles T. Sullivan, R. Mactaggart, R. Mactaggart, Sayan D. Mukherjee, Sayan D. Mukherjee, Mary K. Hibbs-Brenner, Mary K. Hibbs-Brenner, J. P. Mondal, J. P. Mondal, "Mixed application MMIC technologies: progress in combining RF, digital, and photonic circuits", Proc. SPIE 1475, Monolithic Microwave Integrated Circuits for Sensors, Radar, and Communications Systems, (1 July 1991); doi: 10.1117/12.44499; https://doi.org/10.1117/12.44499


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