1 October 1991 Electronic speckle pattern interferometry for 3-D dynamic deformation analysis in industrial environments
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Abstract
Electronic speckle pattern interferometry (ESPI) is applied to 3-D deformation mapping in practical problems from constructional engineering. The shrinking behavior and bonding ability of repair mortars applied in the restoration of historical stone buildings is monitored. Strategies are illustrated to process the huge amount of deformation data toward parameters characteristic of the relevant processes. Thus, ESPI is extended to routine applications in industrial inspection.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gerd Guelker, Olaf Haack, Klaus D. Hinsch, Claudia Hoelscher, Juergen Kuls, Winfried Platen, "Electronic speckle pattern interferometry for 3-D dynamic deformation analysis in industrial environments", Proc. SPIE 1500, Innovative Optics and Phase Conjugate Optics, (1 October 1991); doi: 10.1117/12.46821; https://doi.org/10.1117/12.46821
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