1 November 1991 Novel cathodic arc plasma PVD system with column target for the deposition of TiN film and other metallic films
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Proceedings Volume 1519, International Conference on Thin Film Physics and Applications; (1991) https://doi.org/10.1117/12.47244
Event: International Conference on Thin Film Physics and Applications, 1991, Shanghai, China
Abstract
A novel cathodic arc plasma physical vapor deposition (PVD) process with column target for the deposition of metals and alloys has been developed. Low voltage and high current power is applied between the column target and anode. With the special designed magnetic field, the arc spots run circularly on the surface on the column target and move up and down with the movement of the magnetic field. The erosion on the target is well distributed. The discharge process is very stable and the working conditions are very wide. The working gas can be argon, nitrogen, oxygen, or any other gases according to the need of the chemical reactive deposition.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Weiyi Liu, Weiyi Liu, Yu Min Li, Yu Min Li, Zhan Jun Cui, Zhan Jun Cui, Tian Xi He, Tian Xi He, "Novel cathodic arc plasma PVD system with column target for the deposition of TiN film and other metallic films", Proc. SPIE 1519, International Conference on Thin Film Physics and Applications, (1 November 1991); doi: 10.1117/12.47244; https://doi.org/10.1117/12.47244
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