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1 November 1991 X-ray evaluation on residual stresses in vapor-deposited hard coatings
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Proceedings Volume 1519, International Conference on Thin Film Physics and Applications; (1991) https://doi.org/10.1117/12.47289
Event: International Conference on Thin Film Physics and Applications, 1991, Shanghai, China
Abstract
Residual stresses in plasma assisted vapor deposited (PECVD) TiN coatings were evaluated with x-ray diffraction method. They are tensile on substrate of cemented carbide, but compressive on that of steel. The magnitude is between those made by chemical vapor deposition (CVD) and physical vapor deposition (PVD). The residual stresses display different values on a substrate of steel or cemented carbide, yet no distinct change on substrates of various kinds of steels or of cemented carbides. As the depositing temperature increases, both the macro and the micro residual stress represented by the relative displacement and the broadening of diffraction profile decrease. This implies that the stresses produced by PECVD in normally lower temperature are dominated mainly by the constituents and microstructural aspects of the coating material rather than by different thermal expansions between the coating and the substrate.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kewei Xu, Jin Chen, Runsheng Gao, Jia Wen He, Cheng Zhao, and Shizhi Li "X-ray evaluation on residual stresses in vapor-deposited hard coatings", Proc. SPIE 1519, International Conference on Thin Film Physics and Applications, (1 November 1991); https://doi.org/10.1117/12.47289
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