Determination of thermal stresses in a bimaterial specimen by moire interferometry

Yilan Kang; Youquan Jia; Ji Du

doi:10.1117/12.57435

1 December 1991 Determination of thermal stresses in a bimaterial specimen by moiré interferometry

Yilan Kang, Youquan Jia, Ji Du

Proceedings Volume 1554, Second International Conference on Photomechanics and Speckle Metrology; (1991) https://doi.org/10.1117/12.57435
Event: San Diego, '91, 1991, San Diego, CA, United States

Abstract

The thermal deformation and stresses of a bimaterial specimen were determined by high sensitive moiré interferometry. A thermal replicate method was developed in which the thermally deformed specimen grating was replicated to a non-thermal expansion glass plate at elevated temperature and viewed at a moiré intermerometer after it was cooled. The carrier fringe technique was used to separate the free thermal expansion and the thermal stress-induced deformation. Based on the test results the thermal strains and stresses around the interface and the stress concentration at the inner corner of the bimaterial specimen were discussed.

Citation Download Citation

Yilan Kang, Youquan Jia, and Ji Du "Determination of thermal stresses in a bimaterial specimen by moiré interferometry", Proc. SPIE 1554, Second International Conference on Photomechanics and Speckle Metrology, (1 December 1991); https://doi.org/10.1117/12.57435

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