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1 December 1991 Development of electron moiré method using a scanning electron microscope
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Abstract
A new Moiré method using a scanning electron microscope (SEM) for the measurement of micro-deformation has been developed. This new method makes it possible to observe the Moiré fringe pattern and SEM image at the same time. In this method, a fine microgrid prepared by electron lithography is used as a model grid, and scanning exposure of the electron beam in a SEM as a master grid. The exposure of electron beam on the specimen with the model grid produces Moiré fringes of bright and dark lines formed by the different amount of the secondary electrons. This fine Moiré fringe pattern is fine and clear enough to measure the strain distribution in a small area. By this method, concentrated strains around a small holes in polyimide resin specimens and also the inhomogeneous micro-deformations such as grain boundary sliding in copper specimens were measured, with high accuracy.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Satoshi Kishimoto, Mitsuru Egashira, and Norio Shinya "Development of electron moiré method using a scanning electron microscope", Proc. SPIE 1554, Second International Conference on Photomechanics and Speckle Metrology, (1 December 1991); https://doi.org/10.1117/12.57487
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