1 December 1991 Interferometric moiré analysis of wood and paper structures
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Proceedings Volume 1554, Second International Conference on Photomechanics and Speckle Metrology; (1991); doi: 10.1117/12.57421
Event: San Diego, '91, 1991, San Diego, CA, United States
Abstract
Moiré interferometry was used here to determine fundamental engineering information of cellulosic (wood, paper) structures. Cyclic creep and fracture behavior of paperboard, and the displacements (strains) in bolted connectors in wood were analyzed with up to 61,000 ℓpi moiré interferometry.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
James B. Hyzer, Jim Shih, Robert E. Rowlands, "Interferometric moiré analysis of wood and paper structures", Proc. SPIE 1554, Second International Conference on Photomechanics and Speckle Metrology, (1 December 1991); doi: 10.1117/12.57421; https://doi.org/10.1117/12.57421
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KEYWORDS
Interferometry

Diffraction gratings

Moire patterns

Silicon

Analytical research

Fringe analysis

Mechanics

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