1 December 1991 Measurement of residual stresses in plastic materials by electronic shearography
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This paper presents a method for measuring residual stresses in plastic materials. The approach is based on measuring the out-of-plane displacement caused by a blind hole drilled on the surface of the test object. The out-of-plane displacement is measured by electronic shearography at video camera speed and hence the results are obtained almost in real-time. Unlike holography, electronic shearography does not require special vibration isolation nor ambient light dependence. These advantageous features make the method practical for qualitative analysis of residual stresses in a production/field environment.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kahwah Long, Y.Y. Hung, Joseph Der Hovanesian, "Measurement of residual stresses in plastic materials by electronic shearography", Proc. SPIE 1554, Second International Conference on Photomechanics and Speckle Metrology, (1 December 1991); doi: 10.1117/12.49485; https://doi.org/10.1117/12.49485


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