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1 December 1991 Diamond multichip modules
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Abstract
Diamond's thermal, mechanical, chemical, electrical and optical properties are ideally suited to the requirements of multichip modules. Gigahertz clock rates and increased device density are facilitated using diamond as a base material and as a hermetic passivation layer. Three dimensional architectures with optical communications would allow high speed communications for advanced designs in computers and rugged electronics. This paper provides an overview of potential applications and advantages of Diamond Multichip Modules.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tracy D. McSheery "Diamond multichip modules", Proc. SPIE 1563, Optical Enhancements to Computing Technology, (1 December 1991); https://doi.org/10.1117/12.2321734
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