Packaging issues for free-space interconnects at the board level

Raymond K. Kostuk

doi:10.1117/12.2321748

1 December 1991 Packaging issues for free-space interconnects at the board level

Raymond K. Kostuk

Proceedings Volume 1563, Optical Enhancements to Computing Technology; (1991) https://doi.org/10.1117/12.2321748
Event: San Diego, '91, 1991, San Diego, CA, United States

Abstract

Many researchers have propsed free-space optical interconnects as an alternative to electrical and optical guided wave techniques for connecting electronic or optical processors1,2. However little discussion has been given to problems associated with system packaging. This presentation provides an overview of several important issues in yjis area which must be solved prior to realizing free-space optical interconnect systems.

Citation Download Citation

Raymond K. Kostuk "Packaging issues for free-space interconnects at the board level", Proc. SPIE 1563, Optical Enhancements to Computing Technology, (1 December 1991); https://doi.org/10.1117/12.2321748

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