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1 December 1991 Packaging issues for free-space interconnects at the board level
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Abstract
Many researchers have propsed free-space optical interconnects as an alternative to electrical and optical guided wave techniques for connecting electronic or optical processors1,2. However little discussion has been given to problems associated with system packaging. This presentation provides an overview of several important issues in yjis area which must be solved prior to realizing free-space optical interconnect systems.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Raymond K. Kostuk "Packaging issues for free-space interconnects at the board level", Proc. SPIE 1563, Optical Enhancements to Computing Technology, (1 December 1991); https://doi.org/10.1117/12.2321748
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