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1 December 1992 Four-channel hybrid receiver using a silicon substrate for packaging
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Abstract
The success andwidespreaduse offiberoptic technology in highvolume applications such as telecommunications and computer interconnects is largely dependent upon the availability oflow-cost optoelectronic subsystems. Typical requirements in the case of local loop telecommunications are several parallel optical channels consisting of both receivers and transmitters performing at speeds of 150 to 600 Mb/s. We describe in this paper the fabrication of a four-channel receiver making use of a hybrid integration approach on a silicon substrate. The performance of a receiver channel as well as its components, an InGaAs metal-semiconductormetal photodetector aligned to a single-mode fiber and connected to a GaAs transimpedance amplifier, will be detailed. In addition, we discuss the integration of metal-insulator-metal (MIM) decoupling capacitors into the silicon substrate design.
© (1992) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
M. Tabasky "Four-channel hybrid receiver using a silicon substrate for packaging", Proc. SPIE 1582, Integrated Optoelectronics for Communication and Processing, (1 December 1992); https://doi.org/10.1117/12.2321796
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