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1 December 1992 Hybrid optoelectronic integration of transmitter arrays on silicon waferboard
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Abstract
Silicon has been investigated as a platform for hybrid integration of optoelectronic, electronic, and optical components in multifiber systems. Mechanical alignment features fabricated on the surface of a silicon chip have been used to passively align the active regions of an individually addressable InGaAsPIInP laser array to four single-mode fibers. Optical coupling efficiencies have been achieved that are comparable to values obtained using the conventional technique of active fiber manipulation. Efforts are under way to fabricate hybrid transmitter arrays by the addition of GaAs electronic integrated circuits. This integration approach, which is termed silicon waferboard, has the potential to offer a compact, low-cost integration/packaging technology that can be applied to fiber-rich optical systems.
© (1992) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
C. A. Armiento "Hybrid optoelectronic integration of transmitter arrays on silicon waferboard", Proc. SPIE 1582, Integrated Optoelectronics for Communication and Processing, (1 December 1992); https://doi.org/10.1117/12.2321792
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