1 January 1992 Dynamic design processing of integrated circuits for an "on target" end product
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Proceedings Volume 1594, Process Module Metrology, Control and Clustering; (1992); doi: 10.1117/12.56624
Event: Microelectronic Processing Integration, 1991, San Jose, CA, United States
Abstract
As an extension to approaches in wafer processing, a new technique is being developed: Dynamic Design Processing. This technique is based on the recalculation of design specifications, whenever the results of any process step diverge specifications. These random divergences are inherent in any processing step. Recalculation of the design specification values restores the final performance of the device to the desired one. Simulation results show that applying this technique is practically equivalent to eliminating the process randomness.
© (1992) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Renate Sitte, Sima Dimitrijev, H. Barry Harrison, "Dynamic design processing of integrated circuits for an "on target" end product", Proc. SPIE 1594, Process Module Metrology, Control and Clustering, (1 January 1992); doi: 10.1117/12.56624; http://dx.doi.org/10.1117/12.56624
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KEYWORDS
Oxides

Monte Carlo methods

Integrated circuits

Semiconducting wafers

Device simulation

Integrated circuit design

Transistors

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